Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Copper Dissolution

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Ajay

#37852

Copper Dissolution | 14 November, 2005

Hi, I have a lead free solder joint 75micron wide & 3mm in length with copper on either side of solder. Is there any method/relationship between Cu dissolution & Cu weight% so that one can determine how much copper can be present in the solder after dissolution or vice versa. Thanks.

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#37861

Copper Dissolution | 14 November, 2005

From Alpha Metals: "The test for copper dissolution was conducted by dipping a pre-fluxed copper wire specimen into the test alloys for a specified time period. The change in diameter of the copper wire is measured and a rate of erosion is determined by the formula: Erosion Rate = [do - df]/Time Where do = Original Diameter, df = Final Diameter."

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