Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Reflow issues with leaded paste and mixed components

Views: 946

#37776

Reflow issues with leaded paste and mixed components | 10 November, 2005

Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 solder components. Could this cause reflow problems in production? I would think that the three different temperature ranges could pose an issue, but I don't know for sure how they would be affected. Thanks! -Ryan

reply »

#37845

Reflow issues with leaded paste and mixed components | 14 November, 2005

When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.

reply »

Reflow Oven

reflow oven profiler