Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time 60 to 90 sec. The question is there any metallic joint between the teminals of the component with the solder alloy. Please advice.