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Micro BGA soldering

Alfred

#4476

Micro BGA soldering | 11 April, 2000

Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thickness, hole sizes, etc. Also, it appear there is probably a special solder paste that can more easily be squeezed through the stencil. What might that be? the chip is: 180 FINE PITCH BALL GRID ARRAY. BODY SIZE:12.0 X 12.0 mm

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#4477

Re: Micro BGA soldering | 11 April, 2000

MPM has a pretty good paper-

http://www.speedlinetechnologies.com/document.php3?A=1364&B=

this might help

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