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ROHS procedure's for handling PCB, Moisture sensitive dev. etc.

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#36483

ROHS procedure's for handling PCB, Moisture sensitive dev. etc. | 2 September, 2005

I have another question can anybody assist me. Is there any specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin)? Moisture Sensitive Devices? or how about throw-out or left over parts?

Is there any paste height/volume requirement for a lead-free process?

Please help me regarding this topic I'm trying to prepare process procedures that we may use in production line.

Regards,

Pyramus

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#36671

ROHS procedure's for handling PCB, Moisture sensitive dev. etc. | 15 September, 2005

Specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin) => Use your board supplier recommendations

Specific procedure or guidelines that need to be followed for handling Moisture Sensitive Devices => J-STD-020 & J-STD-033

Is there any paste height/volume requirement for a lead-free process? => You need to have the proper amount of older on the component lead after soldering.

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