Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Drop components in Secon reflow

Views: 2054

Ftiscar

#36114

Drop components in Secon reflow | 13 August, 2005

Does any body knows if there is a design rule on copper pads against component weight so they do not drop on secon reflow process?

reply »

#36115

Drop components in Secon reflow | 14 August, 2005

Dave

#36332

Drop components in Secon reflow | 25 August, 2005

Try Heller Industrie's website at http://www.hellerindustries.com They have a formula that they offer for free that calculates land pad geometry to component weight to prevent drop off of components during second reflow. If you can't find it, give them a call and they should be able to email it to you.

reply »

Vince

#36334

Drop components in Secon reflow | 26 August, 2005

Hi Dave, as you said Heller has forum showing you how to calculate land pad for component dropped off during second side. Unfortunately I couldn't found it. would you please give me that link, instead of just http://www.hellerindustries.com. Thanks

reply »

Reflow Oven

reflow oven profiler