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Nitrogen Reflow - a source of BGA Voiding?

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Dreamsniper

#35729

Nitrogen Reflow - a source of BGA Voiding? | 25 July, 2005

I'm confused.

A paste Supplier suggested to turn off nitrogen during reflow because it is one source of voiding of bga solder joints...is this true?

regards,

Dreamy

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GS

#35738

Nitrogen Reflow - a source of BGA Voiding? | 26 July, 2005

Why you do not try by yourself ?

Run some BGA reflow with and without N2 then X-ray the solder joints.

Regards

GS

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Bob R.

#35740

Nitrogen Reflow - a source of BGA Voiding? | 26 July, 2005

All you can do is try it.

I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voiding is very dependent on the specific flux chemistry of the paste you're using.

Despite what IPC-7095 says, voids are not a reliability risk except in *very* unusual cases (We've done the thermal cycling and thermal shock and it agrees with what's been published by Motorola and others). Unless you have a customer forcing the issue, I'd ignore it. Whether you use nitrogen or not should be driven by other things, not BGA voiding.

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