Anyone know of a maximum solder overprint formula? I need to overprint a 0.011" wide aperture but want to go out to 0.050" overprint. This seems extreme, but necessary as I can't go out in width due to numerous issues. It seems like one could come up with a formula for the maximum overprint before solder balls would form.
Fabricators take different approaches in developing paste that is more or less prone to solder balling. That being said, you should be able to overprint 250 thou, no problem. Prove this to be correct by printing paste on a scrap board with an obsolete stencil drilled with various sized holes.