I'am having a problem with 0805 component where right after placement, the component tend to move from the pad. I'am using 'horse shoe' aperture for 0805 component to resolve the solder beading issue. Does this 'horse shoe' contributing the skew/shift problem? Is there any standard for solder amount underneath the component before reflow process? and also recommended solder volume for desired pad?
It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature.
We print paste 1:1 with the pad.
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