Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA 1517 XLINX REFLOW PROFILE

james

#34481

BGA 1517 XLINX REFLOW PROFILE | 25 May, 2005

Has anyone had good luck with the reflow on these extremely heavy bga's. This bga has 1517 balls and requires alot of heat because of the thickness of the part. Just wondering if anyone out there can help me.

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RDR

#34485

BGA 1517 XLINX REFLOW PROFILE | 25 May, 2005

What are the problems that you are seeing?

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KEN

#34495

BGA 1517 XLINX REFLOW PROFILE | 25 May, 2005

...just placed 100 xilinx 1681. These have the integrated heat sinks and bubba these need a lot of heat. You end up with 0402's on the very end of the board that get very hot (225-230) just so you can get the xilinx up to 215C at the balls.

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james

#34518

BGA 1517 XLINX REFLOW PROFILE | 26 May, 2005

What is the highest temperature set at in your oven and your belt speed. Also what type of oven do you have? Thanks much. Your right about alot of heat needed. We actually see the outside balls much flatter and soldered compared to the middle balls.

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KEN

#34555

BGA 1517 XLINX REFLOW PROFILE | 26 May, 2005

This is caused by cte mis-match. The balls in the corners are short and fat. The balls near the null point are tall and more normalized.

I don't remember what the zone settings were... BTU VIP98

BS was probably 22-25 IPM

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james

#34588

BGA 1517 XLINX REFLOW PROFILE | 27 May, 2005

But I think the customer is returning these because they are not working in the field due to soldering issues.

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james

#34692

BGA 1517 XLINX REFLOW PROFILE | 2 June, 2005

Any other advice??

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#34694

BGA 1517 XLINX REFLOW PROFILE | 2 June, 2005

Xilinx recommended reflow ||Sn-Pb Eutetic||Sn-Pb Eutetic ||Pb-Free||Pb-Free Profile Feature||Large Body||Small Body||Large Body||Small Body Average ramp-up rate (TL-TP), *C/seconds max||3||3||3||3 Preheat - Temperature Min (Tsmin), *C||100||100||150||150 - Temperature Max (Tsmax), *C||150||150||200||200 - Tme (min to max) (ts), seconds||60-120||60-120||60-180||60-180 Tsmax to TL - Ramp-up Rate, *C/seconds max||3||3||3||3 Time maintained above: - Temperature (TL), *C ||183||183||217||217 - Time (tL), seconds||60-150||60-150||60-150||60-150 Peak Temperature, *C||225 +0/-5||240 +0/-5 ||245 +0/-5 ||250 +0/-5 Time within 5*C of actual Peak Temperature (tP), seconds||10-30||10-30||10-30||20-40 Ramp-down rate, *C/sec max||6||6||6||6 Time duration 25*C to Peak Temperature, minutes max||6||6||8||8 Note: All temperatures refer to topside of a package and are measured on the package body surface

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reflow oven profiler

Reflow Oven