Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


How to get away jointing problem

#33509

How to get away jointing problem | 3 April, 2005

I have a problem in my Lead Free smt production line,i run BGA product for the first time. The product consist BGA and Connectors. If i increase temperature in Reflow Oven it will be melting the Connector, but when i decrease the temp. BGA become raw.

A person tell me the problem came from Reflow Oven, Actually the oven is a brand new 8 zone water cooling.

Please hep me on this... Thx

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#33515

How to get away jointing problem | 4 April, 2005

Can you run one thermal cycle to attach the BGA and then a different thermal cycle to attach the connector?

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RDR

#33528

How to get away jointing problem | 4 April, 2005

What are the max temp specs for each of the components? this sounds like the real problem with lead free conversion. Which parts are which? Currently we are getting ready to reball lead free BGAs back to lead for a customer that had to be lead free and must have forgot to spec in the rest of the parts lead free. We had the same situation. If you cannot get the correct connector then I would look into Daves recommendation.

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#33542

How to get away jointing problem | 5 April, 2005

Seems what russ told me is make a sense, I will try to get a good connector or at least try daves recommendation if there is no changes. Thanks guys

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