Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Via tenting/filling with BGAs

jdumont

#33350

Via tenting/filling with BGAs | 22 March, 2005

Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD

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#33360

Via tenting/filling with BGAs | 22 March, 2005

Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides.

Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA via with no tenting, plugging, or filling allows: * Via to scavange solder from the BGA solderball connection. * Heat from wave solder pot to reflow BGA solderballs. * Solder from wave solder to wick to the BGA solderballs.

Q3. What type of issues can this cause if using an improper via design? A3. Improper via design can make the board operate incorrectly.

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KEN

#33370

Via tenting/filling with BGAs | 23 March, 2005

I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.

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