Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Hybrid solder balls

David Hatherall

#4165

Hybrid solder balls | 12 May, 2000

Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls.

we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommending pad sizesand amount of solder to deposit and any other info you think may help me out....

many thanks

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#4166

Re: Hybrid solder balls | 15 May, 2000

David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules * 2220 - IPC 2220 Series * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * 6010-SERIES - IPC-6010 Series * 6015 - Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconne * JPCA-RDMAP98 - Report on Technology Roadmap for Advanced System Integration & Packaging

Good luck Dave F

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