In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific.
What guidance in terms of minimum mechanical solder joint strength and reliability testing would the knowledgeable designers (for CLASS II products)have for us? (We are NOT designers of circuit boards, systems or devices). Any test protocol standards? What would be the acceptance criteria for pass/fail be? What type of measurements would be required as a minimum?