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0.5 mm pitch BGA

Guest

#32919

0.5 mm pitch BGA | 28 February, 2005

I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components can be done with good yield in a production environment, but hopefully there are some new insights now. What is the best solder paste for applications like this?

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ABHI

#32985

0.5 mm pitch BGA | 2 March, 2005

What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.

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#32989

0.5 mm pitch BGA | 2 March, 2005

Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard

The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern geometries for each component that allows the user to select a land pattern based on desired component density. Also includes updates to existing sections addressing land pattern guidelines for wave or reflow soldering, via location guidelines, fiducials and courtyard boundaries. IPC-7351 includes both the standard and a IPC-7351 land pattern viewer on CD-ROM. 92 Pages. Released February 2005. http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50

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Guest

#33000

0.5 mm pitch BGA | 2 March, 2005

Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.

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