Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Something like train the trainer, where you can get a certificate of accomplishment and hopefully material to support the training.
I find the basics are simple and easily learned, it's the questionable areas, like BGA shape that is not the norm, acceptable void (s), etc...the fine tuning needed to assure the Customer you know what you are talking about. It would also ensure the BGAs are not removed uncecessarily or left on when they should be replaced.
It is understood the person reviewing the x-rays for acceptance must be very familiar with Class 3 solderability acceptance, and that the external ball shape as viewed with an Ersa type scope plays an important part in the acceptance/rejection of a BGA. It is also understood the IPC -610-D will cover some aspects.