Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA Specifications for IPC Class

#32425

BGA Specifications for IPC Class | 2 February, 2005

I would like to know if anyone has an IPC specification for BGA's handy? I'm looking for specifics based on Classification. Roundness, %voids, size, etc. Please let me know if you have this.

Thanks Bob

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BTY

#32427

BGA Specifications for IPC Class | 2 February, 2005

try refering IPC-7095 Design and Assembly Process Implementatin for BGAs. I hope it helps.

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#32429

BGA Specifications for IPC Class | 2 February, 2005

Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area.

Class III Small: Void area is LT 9% Class II Medium: Void area GT 9% but LT 20.25% Class I Large: Void area GT 20.25% but LT 36%

This standard does not specify a category for voids GT 36% and assumes that is beyond acceptable limits of most products. Class III product would be for highest reliability with the smallest allowable void area.

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