Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Restructuring Rework Process - Back to Basic

Nifhail

#32346

Restructuring Rework Process - Back to Basic | 31 January, 2005

Hi all,

In general, I am looking at restructuring of our rework processes in our factory. Despite all the effort put into design, process, material etc, there will always be some assemblies that must be repaired. Over the years, alot of hi-technology packages were introduced in our factory, reject rate at rework processes were inconsistent, be it from a simple BGA to a stacked BGAs and to a fine uBGA. To cut the story short, I wanted to go back to basic but just don't know where to start. Any of you have any recommendations for me to start with. What are the items I should look at.

Inputs are much appreciated.

thanks.

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#32383

Restructuring Rework Process - Back to Basic | 1 February, 2005

I agree re; "always will be some assemblies that must be repaired". This is unlikely to lessen in the near term with an imminent move toward Lead-free. We are currently working with Cookson, PACE, and BEST developing a course in lead-free rework which deals with some of the issues in both tin/lead and lead free. Qualified equipment and process together with qualified staff are the key elements.

Sometimes in training we take too much for granted, and concentrate on "what" to the detriment of "why?". Looking at the knowledge component of the rework problem is a big part of "back to basics".

Dr. Bob Abell Automated Learning

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