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Ball Grid Array Prototyping

Adam

#32253

Ball Grid Array Prototyping | 26 January, 2005

Are there any methods for mounting ball grid arrays without a reflow oven? More and more chips are coming in the format and as a student I am not interested in production line quantities.

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#32263

Ball Grid Array Prototyping | 26 January, 2005

You can place them by hand and reflow them using a toaster oven if you use SIPAD ssd with adhesive flux. Yes, I said a toaster oven. It is being done!!

Convection ovens work best.

Give me a call and I will send you some sample boards to try it out with.

Matt Kehoe 770-475-4576 www.sipad.com

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#32266

Ball Grid Array Prototyping | 26 January, 2005


RDR

#32286

Ball Grid Array Prototyping | 26 January, 2005

You could also flux the pads on a bare board without SSD and reflow them in a toaster oven. If they are not high temp solder balls >240C melt point. Maybe try a hair dryer also that should give you convection heat! kidding even though I have performed this and it did work.

Russ

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