Dimension: 7.25 inches L x 6.45 inches W Thickness: 0.102" (2.5mm) No. of Layers: 12 Material: FR4, Tg >=130�C as per IPC-4104/21
What will happen if I expose the PWB Assembly with components to a temperature of between 135'C to 152'C, which is above Tg, for 1 hour? Will there be delamination or possible damage to my PWB? What about with the rests of the components (0603's, 0805's - ceramic caps etc.)? How about my PBGA with FR4 which will suffer on the same stressful temperature exposure?
The reason for this exercise is a proposal to solder some connectors with more than 200 pins for modification and requires a hot plate with 185'C temp under the PWB during the modification process. Estimated tact time for the process is 60 to 90 minutes.
In addition to the potential problems you mentioned, add: * Barrel cracking of PTH and via. * Lifted pads. * Warped boards.
And the reason you're not using a solder fountain to to solder this connector is?
Or use an old trick we've done here on SMTnet for years [NOTE: This is a paste from a previous thread on Mictor connector removal, but you'll get the idea how it'll work in your situation.] as follows: * Buy two Leister [800.700.6894 http://www.hotairtools.com/products.htm ] hot air soldering tools, each with a nozzle for your Mictor connector. * Cut a hole in a bench and mount the first Leister underneath with the nozzle at the level of the bench. * Place the board with the connector PTH down on the Leister. * Use the second Leister to the top to melt the primary side solder on the connector. * Pull the connector. * Live well. Live long.