Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


IPII v.s IPIII

jerry

#4046

IPII v.s IPIII | 18 May, 2000

Can anyone suggest where i might find product info on Fuji IPII and IPIII not to mention all other fuji products such as QP and CP info? I'm trying to pinpoint differences between the IPII and III. If anyone could help it would be much appreciated.

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Micah Newcomb

#4047

Re: IPII v.s IPIII | 18 May, 2000

Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, IP2 can't transport BGA from MTU without some modification which won't come from Fuji IP3 - Mechanical chucks, places most any odd form part. IP2 - forget it. IP3 - programable placement pressure IP3 faster placement speeds, placement accuracy +-.01mm for chips (same as IP2), +-.025mm for 4side leaded parts vs +-.05mm on IP2. IP3 - up to 24 nozzles Both use the same feeders, both offer MFU's for quick changeover, both hold the same amount of feeders.

Hope this helped a little, good luck. Micah

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Micah Newcomb

#4048

Re: IPII v.s IPIII | 18 May, 2000

On the internet go to www.fujiamerica.com to browse all their products. Have fun.

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