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Lead free component on leaded process

Chua

#32086

Lead free component on leaded process | 14 January, 2005

Hi,

I have component like QFP and connector which is lead free component. And now the process still is leaded process. Pls advise whether I can use the lead free QFP and connector on leaded process.

Appreciate the help.....

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Brad

#32088

Lead free component on leaded process | 15 January, 2005

HI, I actually have ask the same question a while back. Yes, using lead free component in a leaded process should be no problem at all. May required just a little hotter peak temp. during reflow, to achive optimal solderability.

Brad

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Chua

#32095

Lead free component on leaded process | 15 January, 2005

Could you advise what is the min and max peak temperature for this process. Presently, my leaded peak temperature at the range of 215 - 225 deg.C And how do I know that the solderability is at optimal.

Appreciate your help......

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RDR

#32108

Lead free component on leaded process | 17 January, 2005

I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength.

Russ

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Brad

#32109

Lead free component on leaded process | 17 January, 2005

Ya Russ is right for Ti Parts they tend to use more pelladium, which requires a bit more heat average temp increase is about 10 degrees C. from 225-235. As far as optimum solder joint I look for fillets on all sides of leads. The back of the lead is hard to see without magnification, but the front toe and the sides should flow up half the thickness of leg or better with good miniscus.

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Reflow Oven