Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Ag Saturation in SAC solder Paste

Indy

#31765

Ag Saturation in SAC solder Paste | 16 December, 2004

Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following:

1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow soldering is 3.0% Ag (silver), present in the alloy, able to completely saturate the Sn (tin) , so as to prevent leaching of Ag (silver) from the Pd-Ag pad metallization..

Thanks Indy

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