Ag Saturation in SAC solder Paste| 16 December, 2004
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following:
1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow soldering is 3.0% Ag (silver), present in the alloy, able to completely saturate the Sn (tin) , so as to prevent leaching of Ag (silver) from the Pd-Ag pad metallization..