Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA Device with Slanted and Damaged Spheres

Thomas Denison

#31748

BGA Device with Slanted and Damaged Spheres | 15 December, 2004

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the test fixture to shear the spheres in certain areas. The component manufacturer claims that 50% sphere damage and .008" slant of the balls is acceptable. I have never seen a BGA that exhibited this condition even reballed devices. We process hundreds of thousands of BGA's through our plant each year and have never fought an issue of this magnitude before. Does anyone have any insight or similar experience. Your comments and thoughts are appreciated.

This message was posted Add this forum to your site! Click to learn more. the Electronics Forum @

reply »

JohnS

#31797

BGA Device with Slanted and Damaged Spheres | 20 December, 2004

I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,

reply »

Steve

#31840

BGA Device with Slanted and Damaged Spheres | 24 December, 2004

Find another component supplier. If you believe that Crap I have some land I wish to get rid of.

reply »

PCB Soldering Tools

Non-heated dispensing system