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SMT electronics assembly manufacturing forum.


Books Available to Review at SMTnet

Keith Luke

#3998

Books Available to Review at SMTnet | 24 May, 2000

SMTneters,

The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release.

For many new and recent publications I have been inviting authors and editors to participate in our new OnBoard Forum, providing SMTneters with an opportunity to engage leading professionals in discussions on important issues affecting the electronics manufacturing industry.

If you have ideas or suggestions, let me know!

I'll be shipping these out on a first-come-first-serve-basis, so let me know ASAP if any of the titles interest you (or someone else in your organization).

The books currently available for review are:

CHIP SCALE PACKAGE (CSP) Design, Materials, Process, Reliability, and Applications John H. Lau and S.W. Ricky Lee Publication Date: February 22, 1999

MicroChip Fabrication A Practical Guide to Semiconductor Processing Peter Van Zant Publication Date: March 26, 1999

High Performance Printed Circuit Boards Charles A. Harper, Editor Publication Date: February 25, 2000

Following are the book descriptions from the back covers of each:

CHIP SCALE PACKAGE (CSP) Design, Materials, Process, Reliability, and Applications John H. Lau and S.W. Ricky Lee Publication Date: February 22, 1999

The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT).

Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to:

Solve technical and design issues

Find the most efficient, cost-effective CSP solutions for deployments

Answer questions on interfacing, speed, robustness, and more

Compare properties of wirebonds, flip chips, rigid and flex substrates,wafer-level redistribution, and other CSP products

Get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM,Mitsubishi, TI, Amkor, LG Semicon, Tessera, Samsung, Shell Case, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, and other major companies.

Learn about CSP products under development

A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, you'll see why it's the resource of choice for those who want to be at the top of the game.

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MicroChip Fabrication A Practical Guide to Semiconductor Processing Peter Van Zant Publication Date: March 26, 1999

A perfect introduction to the industry that's the backbone of the technology revolution, industry insider Peter Van Zant's Microchip Fabrication is a highly popular, novice-friendly guide to the entire process of semiconductor processing-from raw materials through shipping the finished, packaged device.

Used for training, teaching, and vo-tech programs, and tailor made for any semiconductor professional, Microchip Fabrication features a straightforward, math-free approach. And it details semiconductors from the inside out, covering science basics, its fascinating history, and the latest technical leap forward.

Inside, you'll follow semiconductors through every stage of fabrication. Testing, manufacturing processes, commercial integrated circuit types, and packaging are all explained in simple, nontechnical language.

Along the way, Van Zant introduces challenging quizzes and review summaries that make Microchip Fabrication an ideal text or self-study guide. By the time you've finished this informative "guided tour," you'll have a solid working knowledge of all the important issues and processes, materials and methods involved in semiconductor technology, whether on the sub-atomic level or in the context of large-scale industrial practices.

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High Performance Printed Circuit Boards Charles A. Harper, Editor Publication Date: February 25, 2000

Once outpaced by both semiconductors and system demands, printed circuit boards are now playing catch up. On every scorecard-materials, functions, design, speed, reliability, anufacturability, and versatility-boards have racked up big gains.

Whether you're in design, development, application, or manufacturing, this unique source has the cutting-edge printed circuit information you want, all in one convenient source for easy comparison and research. High Performance Printed Circuit Boards gives you data, details, guidelines, and current developments in the hottest areas, including:

Advances In materials Microvias, builtup multilayers, and high density boards.

Substrates for RF and microwave systems Advanced ceramic substrates for microelectronics.

Flexible circuits for advanced electronic systems.

Design of high-performance circuit boards.

Soldering and cleaning Environmentally conscious materials.

Reliability

If you work with fine feature circuitry, you'll find that this book makes it easier for you to optimize your own results with higher-than-industry standard materials and techniques, best yields and efficiency, and greatest cost effectiveness. The first professional guide to high performance printed circuits, Charles A. Harper's book is an invaluable reference.

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