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Flip Chip with Siplace F 3

Mulitze

#3995

Flip Chip with Siplace F 3 | 25 May, 2000

Has anyone experience in placing Flip-Chips (Pad-Size: 120x120um) with an Siplace F 3?

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Richard Wilders

#3996

Re: Flip Chip with Siplace F 3 | 26 May, 2000

You are looking into quite a critical process. Is the spec. of F3 capable of handling such a component ? A pad of 120u with a pitch of probably 200u or bigger and a ball-to-pad coverage at least 75% comes down to a required placement accuracy of 30u @ 5 sigma (offset included) and Cpk > 1.67. A lower accuracy will result in many off-pad flipchips; this means a lot of displacements. And there is no chance at all the flipchip will self-center back to the correct placement spot. I think you'll have to evaluate machinery that is capable and stable to handle these type of advanced components ...

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