Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Reflow Profiling

#31091

Reflow Profiling | 26 October, 2004

Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to exceed 75 seconds. Peak 220 C. Is that any thing that I am missing. Would like to have some tip on profiling. Thank you so much in advance.

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#31092

Reflow Profiling | 26 October, 2004

Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to exceed 75 seconds. Peak 220 C. Is that any thing that I am missing. Would like to have some tip on profiling. Thank you so much in advance.

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#31100

Reflow Profiling | 26 October, 2004

In every part of the dive, assume the proper position, keep toes pointed always, relax hands but keep pointed, stretch arms, make sure legs are together during takeoff and the dive, hands have to touch the top of the toes in a pike position, moving to a new diving position has to be very fast but not brutal. The choice of a nice bathing suit, of the right color, a shaved face on a sunbathed body are still important factors.

Oh yeh, we almost forgot. Check: IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)

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Rob

#31117

Reflow Profiling | 28 October, 2004

Dave,

I think you'll find you'll score higher if you add a cheeky half twist - you'll get a higher difficulty multiplier on your final score.

Profiling is highly dependant on the quality of your oven, number of zones, temperature profiling tools etc. Generally the more zones you have the smoother the curve & the more accurately you can follow the ideal profile. Remember to take multiple readings accross the PCB as heat does not dissapate uniformly accross a board (Dependant on a number of factors including differing densities of copper in areas of the board).

Rob.

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Grant

#31172

Reflow Profiling | 1 November, 2004

Hi,

I would get a KIC profiler, and put thermocouples on the PCB to get a correct profile. You can enter your specs into the software, and it will give you a simple percentage letting you know where you are inside your process window. 0 is perfect in the middle, while 100% is on the edge, and anything over 100% is out.

Part of the software lets you type in oven temp and conveyer speed settings and it will tell you what it thinks the profile will be, and you can then run that, and it's often very close. They also have a software option that does all the profile simulations automatically, and it will just tell you what it thinks you should use for your product to get the closest to your process window.

They might have your solder paste in the settings too, as the software has a lot of pastes listed. We use a paste from Japan, and they had that. We also run it on our oven controller and it will talk to the oven controller automatically and set new temps, and conveyer speeds. Not sure what ovens it supports though.

Check http://www.kicthermal.com. It's one of the best equpment we have every purchased, and it reduced our rework dramatically, as one of our boards was out based on our manual profile. Download and check the software out, and they also have lots of doc's to read too.

Grant

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#31218

Reflow Profiling | 3 November, 2004

Thanks Grant.

I have Heller 1707 and it has built in thermal profiler. As a start up We won't be able to buy kic, but I have used in past and it is great.

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#31229

Reflow Profiling | 3 November, 2004

For reflow profiling I can offer you the termocouples that you need good price and good delivery and I have more than 2000 in stock hyabro

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Reflow Oven

reflow oven profiler