whitepaper for the lead pitch standard| 22 October, 2004
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IPC-SM-782A - Surface Mount Design & Land Pattern Standard
Get up-to-date land pattern recommendations for ball grid array packages with this latest printing of the popular IPC-SM-782A standard. The document covers land patterns for all types of passive and active components, including resistors, capacitors, MELFs, SOTs, SOPs, SOICs, TSOPs, QFPs, LCCS, PLCCS, and most recently, BGAs. Also included are EIA/JEDEC registered components, land pattern guidelines for wave or reflow soldering, a sophisticated dimensioning system, via location guidelines and V-groove scoring. Includes Amendments 1 and 2. 222 pages. Released January 2000.