Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Intercomnect Characterization



Intercomnect Characterization | 31 May, 2000

Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) contact resistance (Conductive adhesive, solder bump) Attachment process thermocompression bond, ultrasonic, align place and reflow. If you could guide me in the right direction It would be very much appreciated.

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