Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Gold contamination: MOSFET lead pre-tinning

#30372

Gold contamination: MOSFET lead pre-tinning | 2 September, 2004

We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning with solder pots helps, but doesn't seem to eliminate the problem.

Any advice? I'd be forever endebted!!!

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#30375

Gold contamination: MOSFET lead pre-tinning | 2 September, 2004

Curious, but thoughts are: * Your pretinning pot is loaded with gold that has been removed from lead over a period of time * Your failed solder connections are caused by something else other that gold intermetallics * Your tinning process is undisciplined

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