Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Reflow of adjacent component



Reflow of adjacent component | 25 August, 2004

During BGA rework we are asked to protect adjacent compoennt from secondary and/or partial reflow. That is our normal process. However, the customer is asking that the peak temp of the joint at the adjacent component should not exceed 160C. Can you point me to any literature or indusry article that points to this type of requirement. We can achive 175C and beleive that is safe.

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