Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Bump printing with solder paste

#30127

Bump printing with solder paste | 19 August, 2004

We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils for bump printing, they would only offer the package of printer + technology + stencil. So my questions: are there any other manufacturers of stencils for bump printing?

Any informations apreciated.

Erhard Hofmann ADOPT Austria info@adoptsmt.com phone +43-6246-72440

reply »

#30134

Bump printing with solder paste | 19 August, 2004

Hi Erhard,

Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC board as well as cut & clinched leads on PCB bottom side. Global Stencil is in Texas and you can speak with Greg Smith.

MPM has a machine (UltraPrint 2000) specially configured for this process called UltraDot. http://www.speedlinetech.com/mpm/ultradot.aspx

Best Regards, Pete Carry

reply »

Reflow Ovens thermal process improvement

Fluid Dispense Pump Integration