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CRACKED COMPONENTS DURING DEPANELIZATION

robert.barr@xensor.com

#29975

CRACKED COMPONENTS DURING DEPANELIZATION | 10 August, 2004

WE CAN'T SEEM TO FIND A BOARD HOUSE THAT CAN SEPERATE OUR PCB ASSEMBLIES WITHOUT CRACKING COMPONENTS. BEEN THROUGH TWELVE OF THEM. IS IT OUR PROBLEM OR IS ANYBODY ELSE HAVING ANY TROUBLE WITH THIS.

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#29981

CRACKED COMPONENTS DURING DEPANELIZATION | 10 August, 2004

Hey Bob, turn DOWN the volume. Waint daff yano!!!

On the surface of things, if you�ve been to a dozen board houses that have not been able to properly separate boards, we�d kinda be inclined to think it�s you and not them. [In your defense, we have seen lots of pizza cutters in contract shops.]

Let�s go through it. * When you say, �board houses�, do you mean that you are using fab shops to separate your boards? Or are you using assembly shops, like contractors? [We ask this just to be clear, because we'd expect few fabs to have the proper equipment or established process.][Poo, this line of reasoning sure gets us in trouble, after disparaging pizza cutters at contractors, doesn't it?] * What is the situation [eg, board type, thickness, component being damaged, type of separation technology, etc]? * What design steps have you taken to make separartion less stressful on components? * What makes you think the component damage occurs during separation, rather some process previous to that? * What is the scope and breadth of the problem?

Things that capacitor fabricators think:

http://www.avxcorp.com/docs/techinfo/cracks.pdf

http://www.avxcorp.com/docs/techinfo/paramimp.pdf

http://www.avxcorp.com/docs/techinfo/assembly.pdf

http://www.avxcorp.com/docs/techinfo/smzero.pdf

http://www.kemet.com/KEMET/web/homepage/kechome.nsf/vapubfiles/f2106/$file/f2106.pdf

http://www.kemet.com/KEMET/web/homepage/kechome.nsf/vapubfiles/f2111/$file/f2111.pdf

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