I am four weeks into my new job, there always seems to be some issues here with PCB every week.
Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look with naked eye, only under microscope you could see the bubbles/blisters. There are lots of them on the top side of the board, not the wave solder side. I do not think it is caused by wave solder or SMT, I think it is solder mask related. But I do not have any PCB fab experience.
IPC-610-C says it is not an defect, figure 9-14, section 9.2.2. I just do not feel comfortable, there are so many of them on the board, should I treat it as a supplier process indicator and complain about the issue to them? What is the worst case scenario if we leave it there, solder mask peeled off in the field? dendrite growth?