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Underfilled CSP mechanical test

Frank

#3805

Underfilled CSP mechanical test | 15 June, 2000

Hi, all, does anyone know what mechanical test regime is used to qualify underfills for CSP use.

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Paul Houston

#3806

Re: Underfilled CSP mechanical test | 16 June, 2000

We typically use air to air thermal cyling for thermo-mechanical testing. However, you may also want to look at vibration and drop tests. Basically you use the same tests for underfilled CSP's as you would for regular CSP's

Paul CBAR Lab

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Frank

#3807

Re: Underfilled CSP mechanical test | 18 June, 2000

Thanks Paul, Where can I find Specs. on Vibration and drop testing?

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mperry1

#3808

Re: Underfilled CSP mechanical test | 19 June, 2000

Go to www.ipc.org and click on search. search for: IPC Test Methods Manual Section 6

IPC TM-650 Test Methods Manual SECTION 2.6 - ENVIRONMENTAL TEST METHODS

Paul

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#3809

Re: Underfilled CSP mechanical test | 19 June, 2000

Frank: Good luck on finding a specification.

The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that match-up well with their product. Also they might be the best source of information how you should best to go about qualifying that supplier.

Alternately, the following links may provide you direction: http://physics.adm.binghamton.edu/pplates.html http://www.obd.com/oki/otr/html/nf/otr-158-18-5.html http://www.asymtek.com/TechPapers/ http://www.chemical.felpro.com/electronics/faq-cob.html

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