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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


High Volume BGA re-balling

My Nguyen

#28599

High Volume BGA re-balling | 13 May, 2004

Hello all:

We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip)

BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch: 0.80 mm

The current method we've used (BGA reballing by applying ball and flux) is just ok for small volume only.

Please advise.

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GS

#28600

High Volume BGA re-balling | 13 May, 2004

Try contacting Process Sciences in Austin tx at 512-259-7070 They can do that process for you without you having to lay out a ton of $ for equipment

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steve

#28610

High Volume BGA re-balling | 14 May, 2004

What state are you located in? Will supply local contact for you based on your location.

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bwet

#28620

High Volume BGA re-balling | 14 May, 2004

Perhaps you can try to use the new StencilQuik(TM) technque as it more easily facilitates solder balls dropping onto the pads.

Info at http://www.solder.net/stencilquik.asp

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