Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


applying DOE to SMT process

Jack Hou

#3764

applying DOE to SMT process | 19 June, 2000

Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's the best characteristic for this experiment? 3. do I need to consider the quality of post-reflow to this experiment?

Thanks in advance Jack

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#3765

Re: applying DOE to SMT process | 20 June, 2000

Hi Jack: Welcome!!!! Yours sounds like an interesting project. In response to your questions:

A1. Each traditional L8 run requires 8 runs. So, how did you select a L8? A2. In addition solder height and volume as characteristics, consider deposition position accuracy. What the hey, why not look at brick shape? A3. Admittedly, the bottom line for this is good product out of the oven, but if consider the quality of post-reflow in this experiment, reflow processes could confound your results.

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