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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Moisture sensitive IC rework requirement

CT

#28252

Moisture sensitive IC rework requirement | 26 April, 2004

Hi, I'm setting up a procedure for Moisture sensitive IC rework. Would like to understand what is the baking requirement for a board before a moisture sensitive IC can be remove from a board.

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Francois Monette

#28256

Moisture sensitive IC rework requirement | 27 April, 2004

Hi CT,

The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the joint IPC/JEDEC J-STD-033A (link for free download at http://www.cogiscan.com, click on MSD Knowledge Base/Introduction).

Normally you pick the highest possible temperature to minimize the duration. In this case, depending on the components already assembled on the board this could be 90C or 125C. The total time will depend on the MS level and body thickness of the component you want to remove. This can range from 3 hours to 10 days.

Let me know if you have any other question on this subject.

Regards,

Francois Monette Cogiscan Inc. Tel : 450-534-2644 fmonette@cogiscan.com

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CT

#28279

Moisture sensitive IC rework requirement | 28 April, 2004

Hi Francois, the info is very helpful. Thanks.

regards CT

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