Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA Underfill Rework

Ron W

#27797

BGA Underfill Rework | 29 March, 2004

I was wondering if anyone has attempted to develop a process for the successful removal of a BGA and its underfill. Or, is it the general industry thought process that an underfilled BGA cannot be reworked.

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#27800

BGA Underfill Rework | 29 March, 2004

Few people underfill PBGA. People underfill CCGA, uBGA, and FC. Consider a reworkable underfill on those devices that you expect to rework.

Reworkable underfill candidates * Thermoset: ME526 (Red) * Loctite: 3567 (Cream) * Dexter: FP 4511 (Black)

We understand that Zymet and Emerson & Cuming make reworkable underfills, also.

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#28264

BGA Underfill Rework | 27 April, 2004

Hello Ron,

Successful removal of an underfilled BGA requires the use of a reworkable underfill, which Zymet manufactures. For more information on such products, send an inquiry to info@zymet.com.

Regards, Carol

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