Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Oven Profile

Robert

#27543

Oven Profile | 8 March, 2004

Need some suggestions on oven profile. I run a BTU VIP98 oven. Has 7 zones, convention heat and all. My profile goes (in Celcius) 150/160/170/180/205/215/180 moving at 28in/min. Roughly 5 minutes from start to finish. I use Kester 256 solder and my board thickness ranges from 1.58mm to 2.31mm. Board is generally heavily populated and densely grouped. My old profile was 150/160/170/180/210/220/190. Because I was afraid of thermal stress I lowered the temps.

Is this a good profile? Or is there room for improvement. BTW, my working environment is clean, temp around 75deg with maybe 50%RH.

I would love to see what profiles other people are using and what kind of results they are getting.

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pdeuel

#27545

Oven Profile | 8 March, 2004

Get a Mole for profileing.

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Ken

#27552

Oven Profile | 8 March, 2004

Robert, what you have provided is not a "profile". It is a "recipe" or "job".

I have 4 BTU VIP98's. I have hundreds of recipes...Your temps look similar to mine....but what does that have to do with the "thermal profile" as experienced by the assembly, parts and solder? Nothing. You need a data acquisition system to probe the assembly and thermally "map" the temp expsoure cycle. In fact I bet your machine is equiped with three T/C mini connectors just below the monitor. By setting up the data recorder you could profile the board. Albeit, 3 T/C's is pretty weak, but you could probe different areas on multiple passes....get my drift...

No one can tell you if it's correct or not. There are just too many variables....

Oh yeah, do you have the Nokia option? I was just currious why the last zone was 180C? It really looks like you have a 6 zone oven....is this because you trying to contol the cooling rate from peak to 183? What is you cooling rate (-C)/ sec?

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van

#27558

Oven Profile | 9 March, 2004

what you have provided are the settings on the oven and not the temperature profile (which represents the actual temperature experienced by the cards as they pass thru the chambers). Usually, solder paste manufacturers provide recommended specs for temperature profile according for their solder pastes. You can start from there. Your customer might also have some preference.

jun

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Robert

#27563

Oven Profile | 9 March, 2004

Yes, in fact I do have 3 T/C connectors but I've never known how to use them nor what to connect to them. I generally address problems by merely changing the recipe up or down depending on what I see on the board(s). Someone mentioned to use a MOLE but I'm afraid I have no clue what that is and how it works.

Don't know if I have the Nokia option. But the oven is indeed 7 zones. On the graphic windows I can see 7 top/bottom temp settings. The last zone is set at 180 simply because I wanted to cool the board down gradually. I don't know my cooling rate but I know that the board travels through each zone roughly in 45 sec.

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#27564

Oven Profile | 9 March, 2004

Use ECD Xpert Ready system. This unit will helos you to predict and recommend you a correct profile. This will helps you to reduce downtime and improve your process too.

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#27565

Oven Profile | 9 March, 2004

I am not familiar with the VIP98, but I have worked with other BTU models for several years. As I have posted in earlier threads: there is absolutely no way to tell whether your profile is correct unless you attach thermo couples to your board and run a profile.Your paste manufacturer should supply you with the relevant specs for creating a proper profile. What you were describing is a recipe. Not a profile. I am not sure why your last setting is 190....? If you have a cooling section, then that last temp. setting should be 215C or higher.(I would think) I would highly,highly recommend purchasing an offline profiler/data logger such as a mole or datapaq. Without doing this you are shooting in the dark.

B.T.W.- 215C sounds low for your last heater setting. But as I have stated I have never worked with a 98.

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#27568

Oven Profile | 9 March, 2004

hi, send me the data for the bds.(gerber,DXF) and I'll give you some step by step info on how to profile this bd w 3 TC and the oven software. R

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Robert

#27604

Oven Profile | 10 March, 2004

Thanks for the offer. However, I do not have access to the gerbers as I am only a low level personnel running the SMT line. I'll probably try and win approval for the purchase of a MOLE or datalogger and go from there.

Thanks all.

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Ken

#27614

Oven Profile | 10 March, 2004

check out KIC Thermal Profiling....good, simple tool to use for profiling.

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Ben

#27695

Oven Profile | 21 March, 2004

I know this response comes late, but my advice is to get your paste supplier in for some good profiling time before you decide how to do your own. My paste supplier will come in on a moments notice if I need them.

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