Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplanarity of leads, etc � Board you are using. For instance: Type material, number of layers, solderability preservative, pad size for IC of the RF unit (IC101), etc � Printing of solder paste. For instance: Stencil thickness, aperture size and shape, paste type, printing method, etc � Soldering of IC of the RF unit (IC101). For instance: Is it attached for first reflow? Second reflow? How does wave soldering affect the component? � Problem. For instance: Is it always the same lead? How often does this occur? Does it occur after 2nd reflow? Is it the lead or the component that is lifting? Have you checked the solderability of the component?
In response to your questions: Q1: Is it possible problem with PWB or temp? � Yes, there could be a problem with the solderability of the board. Yes, there could be a problem with the layout of the board. � Yes, there could be a problem with the reflow profile.
Q2: Is it problem with Resist eye printing? � Yes, there could be a problem with the resist on the board. � Yes, there could be a problem with paste printing.