Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

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potted components-reflow soldering

heccles

#27076

potted components-reflow soldering | 2 February, 2004

Anybody seen problems with potted trimpots and reflow soldering - specifically poor wetting as a consequence of lead contamination from the potting compound. Regardless of reflow profile used (MIL -STD -202) cannot get a good joint formed ! If you use these type of potted devices try pulling one off for a look at the joint.

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#27104

potted components-reflow soldering | 2 February, 2004

If you have potting compound on your solderable surfaces, you can develop reflow recipes until they are picking cotton on Antarctica and they will not take solder. You should: * Tell your buyer [customer] not to purchase parts with unsolderable leads. * Reject parts with unsolderable leads at incoming inspection.

Heccles: Do you refer to MIL-STD-202, because you are using Method 208 as your solderability test? Er, what?

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Reflow Oven