Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


osp finish

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#26938

osp finish | 21 January, 2004

Does anyone have any reports on OSP pcb finish and ICT Testing? Having a problem with contact issues.

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#26941

osp finish | 21 January, 2004

As with noclean flux, OSP will fill your probes with crunchy [maybe gummy] stuff. Consider: * Increasing frequency of probe maintenance * Talking to your probe supplier about alternate probes that self-clean better

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#26949

osp finish | 21 January, 2004

Hi,

Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.

Regards, Patrick

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Kris

#26950

osp finish | 21 January, 2004

Hi,

I had the same question. In our case we are contacting the copper with the osp coating (not soldered).

any published reports that we can reference

Thanks

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#26953

osp finish | 22 January, 2004

Kris,

You will need to change your probes to "bite" into the surface twisting probes specialy designed for copper surfaces. The surface hardness of copper is a lot higher compared to tin. link to article from osp manufacturer (see page 5) http://www.enthone-omi.com/electronics/pdf/05enthone.pdf

good luck Patrick

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#26954

osp finish | 22 January, 2004

Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.

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Kris

#26967

osp finish | 23 January, 2004

Thanks Guys

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 Reflow System

PCB X-Ray Inspection System