Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed roughly throughout the solder and not as concentrated at a boundry, as the more familiar CuxSnx IMC. [You are most likely to see Ag3Sn at routine soldering temperatures than Ag6Sn.] * As we recall, Ag makes the solder alloy looser and less sluggish, making it easier for the voids to "escape".