Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Sn62 eliminates voids on BGA ?

#26903

Sn62 eliminates voids on BGA ? | 15 January, 2004

Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?

reply »

#26905

Sn62 eliminates voids on BGA ? | 15 January, 2004

Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429

Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed roughly throughout the solder and not as concentrated at a boundry, as the more familiar CuxSnx IMC. [You are most likely to see Ag3Sn at routine soldering temperatures than Ag6Sn.] * As we recall, Ag makes the solder alloy looser and less sluggish, making it easier for the voids to "escape".

reply »

mk

#26910

Sn62 eliminates voids on BGA ? | 16 January, 2004

ssd eliminates voids from BGA's. Check out http://www.sipad.com

This message was posted Add this forum to your site! Click to learn more. the Electronics Forum @

reply »

Boundary Scan

PCB Soldering Tools