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voids- leaded and chip components

Kris

#26832

voids- leaded and chip components | 12 January, 2004

Hi,

Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices

Appreciate your help-

thanks

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#26881

voids- leaded and chip components | 13 January, 2004

No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA with their xray machine.

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Kris

#26891

voids- leaded and chip components | 14 January, 2004

Thanks Dave

Will appreciate if any body has any published information on a study they did for voids in leaded devices

Will try to talk to them Dave

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menglong

#26931

voids- leaded and chip components | 19 January, 2004

we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ?

any suggestion, pls keep me informed

contact me :zhanglg@tpv.com.cn

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#26968

voids- leaded and chip components | 23 January, 2004

Kris,

I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)

Hope this helps if not let me know Patrick

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