Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA Thermal Cycling Tests?

bwet

#26389

BGA Thermal Cycling Tests? | 19 November, 2003

We are looking for recommendations on reliability testing (thermal cycling, vibration, etc.) of BGAs AFTER being soldered to a PCB. Are there any standards that include such things as heating cycles (like a minimum of 5,000 cycles), ball-ball leakage and the like? Can anyone share this kind of information that they may have gotten from an IC vendor or by other companies that can be/should be used as a benchmark?

This message was posted Add this forum to your site! Click to learn more. the Electronics Forum @

reply »

#26392

BGA Thermal Cycling Tests? | 19 November, 2003

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

reply »

reflow oven profiler

PCB Soldering Tools