Soldering Lead-Free Globtop BGA to Pin-Socket Interposer| 18 November, 2003
Yup. I'm attempting a small, but very important experiment. I need to solder several Lead-Free Globtop BGA parts to a Pin-Socket interposer assembly. I'm trying to come up with the best way to do this. I'm thinking of using lead-free solder paste, (but I'm worried about how hot I'll have to get it. Will it damage the Globtop?), standard solder paste, or just a paste flux applied directly to the interposer pads, (using a stencil), and placing the part on top. I've only got a couple (5) samples, so I've got to make each one count. Any suggestions???? (I LOVE my job!!!!)
Soldering Lead-Free Globtop BGA to Pin-Socket Interposer| 19 November, 2003
We'd be incluned to dip the BGA ball in tacky flux, place the BGA on the PTH interposer, reflow that suka, and get on with things. [Take the people involved out to lunch with the money you save on not buying a stencil.]
On damaging the glop top, we'd hope that the fine person that decided to select a particular glob would have talked the fine person that selected a particular lead-free crap. [What does the component supplier say?]
Soldering Lead-Free Globtop BGA to Pin-Socket Interposer| 20 November, 2003
What do they say? Not too much as of yet. (I haven't actually recieved them yet.) The parts are being custom made by my customer. I've already bought my stencil, so I'm thinking I'm just going to try and stencil the tacky flux right on the pads and place the part. We'll give it a go and I'll let you know how it turns out!!
Soldering Lead-Free Globtop BGA to Pin-Socket Interposer| 21 November, 2003
If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works well.
Soldering Lead-Free Globtop BGA to Pin-Socket Interposer| 4 December, 2003
I'm ex Fuji smt service engineer, now I'm leading a a team wich repairs pc-boards in Europe. During replacing P4 processor socket I use an old srt-bga rework staion and an mimistencil wich can be placed abowe the bga pads. My 5 Y experience says when I process anithing I should remowe any grease/fat form pcb to make constant the surface of the pcb. Operators and warehouse members do not touch pcb before printing. Now at rework usual BGA-s I replace widout any stenciling yust first flux remover than 186 flux ( I know my customer dosen't like it) then placing. At socket not ewery operator is allowed to place it because of accuracy,
KEY heat the pcb form the odher side minimum 150 ! celsius during the second period on your profile.