Does IPC list a specification that describes the acceptable thermal stress capabililty of components? I seem to recall something about dipping at 260C for 10 seconds, but I can't find the reference. Also seem to remember descriptions of the allowable thermal excursions. Any help will be appreciated. Thanks John
There may have been something like that in the past, but now-a-days the IPC says stuff like, "make sure the temperature that you use to not adversely affect the performance of the components." [er words to that effect]
Probably, the "260*C / 10 second"-thing that you mention is a guideline that someone developed after the checking the upper temperature limit listed in various component data sheets.