Anyone who has experience on IPC-TM650 environment test 126.96.36.199| 12 November, 2003
Anyone who has experience in IPC-TM-650 Environment test Method 188.8.131.52?
I have a question. It is the procedure to finish electrical connections. According to 184.108.40.206D, there are apparatus which are solder pot, soldering iron and flux. Then solder a single strand PTFE insulated wire to each pad of the board. My question is, is there any standard step to do it? what is the purpose/different between solder pot and soldering iron? No need solder wire (63/37)? How to use flux, soldering iron, solder pot and flux to finish this electrical connection?
If I use common solder wire (63/37) to connect insulated wire to board by soldering iron, then is it ok?
Anyone who has experience on IPC-TM650 environment test 220.127.116.11| 17 November, 2003
The main function of the test is to evaluate the solder mask.
Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on ONE of the solder mask coated boards. You are supposed to remove the flux used for this.
Connect the wires to the specific pads on the board (dependant on test Class) to apply the test bias voltage. This is where the soldering iron comes in. You don't remove the flux used to solder the wire onto the pad unless you get flux on the test pattern.