We are having a problem with one of our chip sets. We have had a sudden change in performance, detrimenatally, and we beleive it may be a result of a change in die size. we need to prove this. Does anybody know a good contact or company who specialises in measuring the die size of a LCCC or BGA package to test for die shrinkage?
Also, consider the materials lab at your local unversity. For instance: Cemal Basaran, Dr Associate Professor SUNY Buffalo 716-645-2114 X2429 Fax: 3773 [ email@example.com ] 243 Ketler Hall North Campus SUNY at Buffalo Buffalo, NY 14215